IPC T-50G

$50.00

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 12/01/2003

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Description

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision G contains over 500 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, lead free solders, assembly processes, base materials and high speed/high frequency boards. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.

Product Details

Published:
12/01/2003
Number of Pages:
135
File Size:
1 file , 1.4 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus