IPC J-STD-609A

Description

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:

1) those assemblies that are assembled with lead-containing or lead-free solder;
2) components that have lead-containing or lead-free second level interconnect terminal finishes and materials;
3) the maximum component temperature not to be exceeded during assembly or rework processing;
4) the base materials used in the PCB construction, including those PCBs that use halogen-free resin;
5) the surface finish of PCBs; and
6) the conformal coating on PCBAs.

Product Details

Published:

03/01/2010

Number of Pages:

13

File Size:

1 file , 550 KB

Note:

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